Chuen-Yi Wang

Mr. Chuen-Yi Wang

Former Vice President, TAIWAN SEMICONDUCTOR CO., LTD.


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Council Member Biography

Chuen-Yi Wang was the Vice President at Taiwan Semiconductor Company, manufacturing broad line semi components. Responsible for managing, RFID printer+application-specific solutions, Kiosk/POS terminal, laptop, notebook, scanner, LCD projector, DSC, monitor, Semi fabless IC design IDM, Memory. Over 25 years of experience in sales, marketing, manufacturing, operations, services and management based in Taiwan and worldwide. Previously he held positions as Electronics and Electric BU Head at Simmons and management position at Getz Bros. VP of Sales & Marketing of Clevo computer, VP, Sales & Marketing of Modern computer, EVP of KFC USA, SVP of Mustek, USA and VP, Sales of Etron Technology. He switched from Sales and Marketing head at HQ, head of US branch and head of BU in Taiwan. The best solution for an excellent corporate development in high-tech industry - 3D Dynamic & strategic integration based on advanced/ mainstream technology platforms, technology transfer, M&A, JV, alliance, perspectives and vision. (This is me - Update Profile)


Employment History

2003 - 2005
Vice President, TAIWAN SEMICONDUCTOR CO., LTD.
2002 - 2003
Vice President, SEA & LAND INTEGRATED CORP.
2001 - 2001
Vice President of Sales , ETRON TECHNOLOGY INC.
1997 - 1999
Senior Vice President, MUSTEK, INC. USA
1996 - 1997
Executive Vice President, SMILE INTERNATIONAL INC, USA
1994 - 1996
Vice President, Sales & Marketing, CLEVO CO.
1991 - 1994
Vice President of Sales and Marketing, Modern Computer Co
1989 - 1991
Sales Director, CLEVO CO.
1988 - 1989
Senior Div Manager, GETZ BROS, & CO., INC. USA.
1984 - 1988
General Manager, Electric Components/Electronic Co, Simmons International Co. USA

GLG NewsSM Analyses by Chuen-Yi Wang

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M&A, JV in HDD Industry and SSD, Embedded System Replacement in 2011

February 19, 2009

Toshiba-Fujitsu Gives Storage Rivals an In | www.thestreet.com

HDD quantity of delivery under NB and the consumption electronic products demand leads, maintains 10~15% year growth rate, the hard disk quantity of delivery growth rate reaches as high as 18.9% in 2007, however because, on the other hand actually also the price competition day by day intensifies, causes the income earning to worsen, causes the hard disk market also to blow the purchase wind, even touches the related components factory. Stops to 2008, after eliminated and the conformity many times, the global hard disk entrepreneur from 41 in 1990, reduced to Seagate, WD, Hitachi Global Storage Technologies; HGST, Samsung, Toshiba and Fujitsu, Total 6. Seagate purchases and takes over Maxor after May, 2006, reaches as high as 35% of the global hard disk market in 2007. Fujitsu is the lowliest place in the hard disk market, because of hard disk enterprise deficit again and again, so that Toshiba is the most powerful customer to take over the Fujitsu hard disk enterprise.

More Rating Cut

February 18, 2009

Hynix Falls Most in Two Months on JPMorgan Rating Cut | www.bloomberg.com

Hynix will not have the reduction of capital plan. Hynix pass on the year's end to sell Oregon the Eugene factory to attain 306,000,000 US dollars in accordance to the turnover. Hynix, the beautiful light offers NAND the Flash technology Taiwan factory not to appreciate kindness rendered solves the DRAM difficult position most first. Hynix’s Creditor bank plans before the end of September to release the stockholder's rights value to estimate 880,000,000 US dollars again. Hynix reduces the workshop promotion disbursement and postpones the mainland joint capital factory investment. Hynix pelts capital outlay the global DRAM supply rate to grow only this year 20~30%, The 4th quarter, 2008 loses money 964,000,000 US dollars analysts anticipated in 2009 transport business difficult to show improvement after illness.   Obviously, JPMorgan will continuously the rating cut again. 

Pricing level based on supply and demand not consolidation

February 11, 2009

Winbond open to DRAM consolidation, says company executive | www.digitimes.com

As 30 X 12" memory fab were built in year 2007 and 14 of 30 were built in Taiwan for which the over supply statement happened with Zero Vista effect. Taiwan government trying to upgrade the advanced/ mainstream processing technology up to 48nm for DRAM and 30nm for NAND for cost down with high yield rate; integrate R&D power between Elpida, Micron and PSC, Inotera, Nanya, ProMos and Windbond. The technology alliance bundled with US$ 3B capitals. Above project is pending for an attractive business proposal. Qimonda went bankruptcy only provide around 10% of market demand which only created 20% price increases; 25% price gap to reach the breakeven price point. The global economic downturn made it worse as a serious storm in the 2nd layer although memory industry needs an M&A/ JV and cost down with advanced technology development as the industry dynamics.  As to the supply and demand relationship, expected to reach the balancing point in 2010 with basic Capex.   

3D Display Market Grows From 4.98M Units in 2007 to 8.12M Units in 2010

August 31, 2007

3-D printing for the masses | money.cnn.com

1. 3D Imaging & display technology international conference 2007 2. 3D interaction & display alliance congress, 3DIDA 3. 3D industry, Present and future

RFID Application

May 9, 2007

Active RFID Technology: MINI USA “Motorby” Pilot Program Features Wavetrend Active RFID Technology | www.rfidsolutionsonline.com

RFID industry needs long-term improvements for individual application.
1. Price - Much higher than target price.
2. Hardware system - Based on ROI, cost and price still too high to application.
3. System - For commercial application, total operation system still not completed and matured yet.
4. Photocol - The global standards still not match yet. EPC running on different frequencies.
5. Tag - Price of the active. semi active, passive tag still two expensive compared with bar code label.
6.  Integration - needs longer time to integrate all standards, acceptable & economic pricing level, software cost, hardware cost cost, AUTO-ID national standard, actual application after integration and high percantage of application.
7. High level of application - The benefit will only be crated by high level of application as a regular control system for AIDC/AUTO-ID applications.

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