Mel Burks

Mr. Mel Burks

Founder / Senior Partner, Tech Quest Research, LLC


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Member of the Technology Council

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Council Member Biography

Mel Burks is with Tech Quest Research, LLC, a market research company providing consultation and in-depth analysis and reports. He is an acknowledged engineering professional within the semiconductor, test & measurement and PV sector. He held positions in semiconductor manufacturing and semi-equipment sector. Mel has over 30 years of direct involvement in various semiconductor technologies including lithography, ion-implantation, etching and metallization. His knowledge-base is on wafer fabrication processes and advanced semiconductor technology nodes (45nm, 32nm and 22nm). For photovolatics, he is knowledgeable on current polysilicon manufacturing techniques and reactors, “thin-film” solar-cell variants using amorphous silicon, microcrystalline, CdTe and CIGS. Mel held positions at ON Semiconductor, Western Digital, Texas Instruments and Candela Nova / Solar Engineering. He has also done contract work throughout the US, Canada, and Asia for such companies as TSMC, Hitachi, Hynix and Motorola. (This is me - Update Profile)


Employment History

2008 - Unspecified
Founder / Senior Partner, Tech Quest Research, LLC
2008 - 2008
Principal Engineer, ON SEMICONDUCTOR CORPORATION
2003 - 2008
Yield and Failure Analysis Engineering Manager, ON SEMICONDUCTOR CORPORATION
1997 - 2003
Thin Films Section Manager, AMI SEMICONDUCTOR, INC.
1988 - 1997
Principal Engineer, AMI Semiconductor, Inc.
1985 - 1988
Co Founder, Candela Nova / Solar Engineering
1983 - 1987
Applications Engineering Manager, ENTEGRIS, INC.
1976 - 1983
Process Engineering Manager, Western Digital Corp

GLG NewsSM Analyses by Mel Burks

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A Contender for the Number-Two Spot in Wafer Foundry Services

June 2, 2009

Chartered Denies Bid From Abu Dhabi’s ATIC | www.semiconductor.net

In 2007, Chartered was ranked number four in revenue market share behind TSMC, UMC and SMIC.   However, an acquisition of Chartered, combined with GlobalFoundries, could conceivably compete for the number two slot challenging UMC but likely not before 2011. An acquisition of Chartered Semiconductor folded into GlobalFoundries would not dislodge TSMC's position as number one foundry provider for fabless companies.

Alternatives for Cost Reduction in Solar Cell Manufacturing – Nano Flakes

January 4, 2008

Nano Flakes May Revolutionize Solar Cells | www.sciencedaily.com

Development of silicon and III-V compound semiconductor nanostructures offers yet another path for low cost production and increased photovoltaic efficiencies. The real question is when how soon these advanced methods will become commercialized. The decisive factor for the success and production of solar modules is the manufacturing cost and how to drive cost lower while improving conversion efficiency.  

Lam Research Acquires New Opportunities with SEZ Acquisition

January 3, 2008

Lam Research rival may bid up price for SEZ Group | www.bizjournals.com

This acquisition is not Lam Research’s first step into wet processing but will be the most significant and application intensive. A very good match considering the industry is in the transitional phase for new materials and device structures at and below the 65nm node and requires an in-depth understanding of the special sensitivities to wet chemistry and etch interactions. As a major player in dielectric etch area, the SEZ acquisition complements the potential for a customer turnkey integrated process.  

Intel and STMicro’s JV Delay to Spansion’s Advantage?

December 28, 2007

Chip Makers Delay a Merger of Their Memory Divisions | www.nytimes.com

The sluggish memory market combined with the credit crunch changes the dynamic for bank funding of the Intel, STMicroelectronic and Francisco Partners joint venture agreement. This delay could impact select semiconductor capital equipment vendors. Competitor Spansion won’t likely benefit from a 3-month delay unless it extends past the second-half of 2008.  

Agilent and Multiprobe Provide Improved IC Test and Analysis Capability

December 26, 2007

Agilent and Multiprobe bring nanoprober to Asia | www.tmworld.com

Nanoscale probing directly at the transistor level for 65nm, 45nm and 32nm IC's has come of age. Agilent and MultiProbe's strategic partnership using Agilent's tester and MultiProbe's atomic force probe (AFP) system is posed to strengthen Agilent’s product offerings to include failure analysis probing. New challenges arise for device manufacturers when transitioning to a new technology node in the form of new materials and increased sensitivity during electrical characterization. This partnership provides the necessary tools and software to easily and rapidly debug the process. Initial sales slated for Asia and Japan could speed deployment of advanced memory types for the latest consumer products and solid-state drive (SSD) applications.

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