Seagate and Samsung to collaborate on enterprise SSD controller development
August 25, 2010
Some Tech Behind the Seagate and Samsung SSD Controller Joint Development Agreement | enterprise.media.seagate.com
Seagate and Samsung announced that they will jointly develop and cross-license SSD controller technology for enterprise storage applications. Seagate is the highest volume manufacturer of enterprise HDDs while Samsung is the largest manufacturer of flash memory. The jointly developed controller is to be used in Seagate’s enterprise SSDs. Seagate joins Hitachi GST in seeking a partner in enterprise SSD development.
3PAR in play as importance of storage in enterprise increases
August 25, 2010
H-P Trumps Dell With Big for 3PAR | www.ibtimes.com
3PAR has competing offers to be acquired by HP and Dell. 3PAR makes highly scalable storage platforms offering virtualization and management automation. The 3PAR bidding war is the latest activity in a recent round of storage company acquisitions . Large storage players appear to be strengthening their product offerings through selective acquisitions.
SanDisk chip-sized SSD enables new computer Products
August 25, 2010
SanDisk Reveals World’s Smallest SSD, the ‘iSSD’ | www.tomshardware.com
SanDisk introduced a 64 GB Solid State Drive (SSD) called an iSSD. The iSSD is a small Ball Grid Array (BGA) chip that can be soldered into a motherboard and used for digital storage in a computer system. The iSSD supports the SATA interface allowing it to respond to the rich storage command set of the SATA specification. An embedded SSD with a very small form factor may help to create new categories of computer devices and consumer products
HDD companies collaborate for new technology introductions
August 25, 2010
Hitachi GST, Seagate and Western Digital formed the Storage Technology Alliance (STA). The STA was formed to help the companies work together to develop technologies to go beyond 1.5 Tbpsi areal density by 2014 or 2015. The new alliance has similarities to SEMI collaborative technology development projects for semiconductor technology development. The STA is working to bring other HDD companies, Samsung and Toshiba, as well as equipment and component technology into the effort.
August 17, 2010
We are awaiting midyear results by the three Chinese operators which will be available in about a week. However, indications point to little excitement but moderate growth. While operators continue to add new customers, thanks to a large population, double-digit growth has become a thing of the past. One area that is dragging their feet is 3G.
Could open source projects be turned into for profit only?
August 14, 2010
Oracle signals an end to OpenSolaris | www.computerworld.com
1. Does Oracle potential announcement of the end of Open Solaris have implications for other open source projects?2. Will this provide an opportunity for larger companies to buy other open source projects?
Huawei Gains in TD-SCDMA and WCDMA Chip
August 1, 2010
Last week China Mobile announced the result of latest bid for TD-SCDMA construction. As I said in my last posting, the bid, the fourth in the past two years, is probably the last large-scale project, aims to extend 3G coverage to 330 cities (238 now) and improve service in current cities. Under pressure from rivals and suffering from a negative public opinion, China Mobile pins high hopes on continuing expansion after spending about 100 billion yuan ($15 billion) for the first three rounds.
The Tablet is not a PC - Will Microsoft understand that?
July 31, 2010
Microsoft Tablets Could Cannibalize Windows PCs: Analyst | www.eweek.com
1. Microsoft tablets are coming. Will they be ho hum like the Zune?2. Can Microsoft deliver a new type of device like a tablet or will it be like their last tablet that is really a touch screen PC?
Cisco Must Qualify Additional Sources to Broaden Its Supply Base.
July 30, 2010
Cisco's supply chain woes lead users to consider alternatives. | searchnetworking.techtarget.com.au
Over the past several years Cisco and others have kept a tight approved vendor list (AVL) and no problems of supply existed.It was becoming clearer over one year ago that there was little component inventory in the pipelines of OEMs, IC suppliers, distributors and contact manufacturers.Now that Kyocera, TI, Kemet, Cirrus Logic, Broadcom and other big suppliers are having trouble with deliveries smaller suppliers will be qualified by agile competitors.
Faster, Cheaper External Storage Coming
July 26, 2010
USB 3.0 chip prices set to drop through the floor | www.techeye.net
Native chips for implementing USB 3.0 connectivity in motherboards will drop dramatically later this year. Chip suppliers for USB 3.0 include NEC, Fresco Logic and Asmedia . Many motherboard manufacturers have announced plans to ship motherboards with USB 3.0 this year. By 2011 we may see a major switch from USB 2.0 to USB 3.0 for external storage devices.
February 7, 2012
SOPA and the wisdom of Yogi Berra
January 19, 2012
Larger wafers present a growth opportunity for LEDs
January 6, 2012
Smartphones threaten digital camera industry
December 1, 2011
Google music launches: The end of the end for the music industry
November 22, 2011